| 摘要 |
PURPOSE:To prevent the formation of a needle mark in a bonding pad section, and to improve reliability by providing a pad section for a probe at a position separate from the bonding pad section regarding the form of the electrode pattern of the semiconductor device. CONSTITUTION:The pad section 4 for the probe is formed continued to the bonding pad section 2 at the position separate from the pad section 2, and the needle mark 3 is put to the pad section. Both distance and positions can be selected properly in consideration of the electrode form and characteristics of an element. The pad section 4 for the probe may be formed separated from the pad section 2 at a predetermined distance, and both pad sections 2, 3 are connected by a thin lead 6 consisting of the same material at that time. |
