| 摘要 |
<p>PURPOSE:To enable to connect between substrates in high density excellent in mass production in a thermal head of division substrate type by forming organic resin connection auxiliary layer between a heating resistor substrate and a multilayer circuit board and connecting both by thin film technique. CONSTITUTION:A heating resistor substrate formed with a glazed layer 2, a heating resistor 3, the first layer conductor 4, a protective film 5 and a wear resistant layer 6, and a matrix substrate formed with the first conductor 4, an insulating layer 7 and the second conductor 8 on a ceramic substrate 1 are bonded fixedly so that the first conductors 4 of the substrate are butted, prepolymer solution of polyimide resin is coated to bury between the substrates, thereby forming a connecting auxiliary layer 11. Then, 2-layer deposition film of Cr-Au is formed by partial mask deposition method to connect the first layer conductors 4 of the both substrates, and connecting conductor 12 is formed by photoetching. A semiconductor element 9 is eventually wire bonded to the second layer conductor 8.</p> |
