| 摘要 |
PURPOSE:To obtain the etching device, which can etch materials to be etched properly and has high productivity, by providing a measuring mechanism measuring the thickness of etching of each material to be etched before etching and a handler mechanism immersing a cartridge into an etching tank for a fixed time on the basis of informations by the measuring mechanism. CONSTITUTION:Only a wafer 2 in a variance region of film thickness in an extent that insufficient etching and excessive one are not generated is controlled by a control system on the basis of informations in case of measurement, and the cartridge lifting mechanism of a wafer feeding section 1 is operated while the wafer 2 is forwarded by a pusher 12. A handler 27 is operated and turned over, the cartridge 4 of a feed section 5 for etching, an inserting detaching port thereof is directed upward, is clamped by a clamper 26, and carried, the cartridge 4 is immersed into an etching liquid 29 in the etching tank 6 for a fixed time, and the aluminum films of the surfaces of each wafer 2 are etched. Etching time at that time is set automatically on the basis of informations in case of measurement of the measuring mechanism 3. |
