| 摘要 |
PURPOSE:To enhance the mounting density on a surface, and moreover to obtain a substrate for mounting multichip with simple wirings by a method wherein the substrate for measurement mounting IC chips and having separated terminals and the substrate for wiring between the chips are made to come in contact after measurement and evaluation of the respective chips to form the substrate. CONSTITUTION:A first substrate 11 is for individual evaluation of chips mounted in multichip type, IC chips 12a, 12b,... are mounted, and the terminals of the respective chips are led out outside through pads 13a and 14a, 13b and 14b,.... A second substrate 15 is the substrate for wiring between the chips, and the necessary wirings to be connected to contacts 13a' and 14a', 13b' and 14b',... corresponding to the respective pads on the substrate 11 are integrated. After evaluation of the IC chips mounted on the substrate 11, the substrate 11 and the substrate 15 are made to attain contact by connecting electrically the pads of the IC chips, and the substrate for multichip mounting is formed. By constructing the substrate 11 and the substrate 15 separately, the mounting surface area is reduced, and mounting density is enhanced. Moreover wiring is facilitated extremely, and to detect an inferior chip and to exchange can be attained easily using the substrate 11. |
