发明名称 |
PROCESS FOR METALLIZING CERAMIC SUBSTRATES |
摘要 |
Ceramic articles or substrates are coated with a metal layer directly and securely bonded to the article or substrate, by a process comprising at least the following steps; (a) treating the substrate surface with a melt comprising one or more alkali metal cpds. ; (b) exposing the surface to a soln. having an acidity of at least 0.001 molar in hydrogen ions CPH up to 3); and (C) exposing the treated surface or selected parts of it to a metal plating bath soln. for depositing the metal. Pref. the substrate is completely coated with the metal deposit, and portions of deposit are removed in a later step thus forming the conductors of a printed circuit pattern.
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申请公布号 |
KR870001779(B1) |
申请公布日期 |
1987.10.10 |
申请号 |
KR19840003194 |
申请日期 |
1984.06.08 |
申请人 |
KOLLMORGEN TECHNOLOGIES CORP. |
发明人 |
DELUCA, MICHAEL A.;MCCORMACK, JOHN F. |
分类号 |
C04B41/51;C04B41/52;C04B41/53;C04B41/88;C04B41/89;C04B41/91;H01L21/48;H05K1/03;H05K3/18;H05K3/38;(IPC1-7):C04B41/88 |
主分类号 |
C04B41/51 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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