发明名称 PROCESS FOR METALLIZING CERAMIC SUBSTRATES
摘要 Ceramic articles or substrates are coated with a metal layer directly and securely bonded to the article or substrate, by a process comprising at least the following steps; (a) treating the substrate surface with a melt comprising one or more alkali metal cpds. ; (b) exposing the surface to a soln. having an acidity of at least 0.001 molar in hydrogen ions CPH up to 3); and (C) exposing the treated surface or selected parts of it to a metal plating bath soln. for depositing the metal. Pref. the substrate is completely coated with the metal deposit, and portions of deposit are removed in a later step thus forming the conductors of a printed circuit pattern.
申请公布号 KR870001779(B1) 申请公布日期 1987.10.10
申请号 KR19840003194 申请日期 1984.06.08
申请人 KOLLMORGEN TECHNOLOGIES CORP. 发明人 DELUCA, MICHAEL A.;MCCORMACK, JOHN F.
分类号 C04B41/51;C04B41/52;C04B41/53;C04B41/88;C04B41/89;C04B41/91;H01L21/48;H05K1/03;H05K3/18;H05K3/38;(IPC1-7):C04B41/88 主分类号 C04B41/51
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