| 摘要 |
PURPOSE:To improve automation and massproductivity by forming a groove to the stepped section of a cover body, bringing a hybrid integrated circuit substrate into contact with the stepped section and bonding the substrate by adhesive resin. CONSTITUTION:In the cover body 11 made of resin with the stepped section 12 with which the substrate is brought into contact, the slender grooves are formed to the stepped section 12 by one or plurality. Such the grooves 13 are formed at the same time as the cover body 11 is shaped by resin and formed, and made surround and arranged continuously to the stepped section 12. To be concrete, two of the grooves 13 with 0.3mm. depth and 0.5mm. width are formed to the stepped section 12 with 1.5mm. width. Liquefied adhesive resin 14 is dropped to a plurality of positions in the grooves 13 of the stepped section 12, is flowed into the grooves 13 and adheres to the whole grooves 13. Surface tension is utilized and the adhesive resin 14 spreads over the whole grooves 13 and can be arranged in uniform quantity and uniform thickness because the grooves 13 are utilized. The circumferential end of the substrate 10 is brought into contact with the stepped section 12, the adhesive resin 14 is heated and cured, the substrate 10 and the cover body 11 are unified together, and the integrated circuit is sealed. |
