| 摘要 |
<p>The printed circuit fabrication technique is designed to prevent the edges of the metal layers touching when the circuits are cut into sections. This is achieved by sticking the metal layer only at the circuit contact locations. The adherence of the metal layer can be brought about by a variety of methods. In one version, the printed circuit base material on the metal layer, can have the circuit outline registered by a screen-printing gluing method. Alternatively, the two surfaces can be joined by application of a separate adhesive. One of the two surfaces can have a heat-activated adhesive layer and the hot-plate of the press carries the circuit outline. In this variation the two surfaces stick together only at the circuit outlines. The circuit elements are cut out by following a template outline and the parts of the circuit which are not glued are separated from the circuit elements.</p> |
