发明名称 STEM FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To effectively obtain a high bondability by inserting a sealing member into the lead inserting hole of a stem made of iron containing the prescribed content of C. CONSTITUTION:A stem body 2 contains 0.05-0.15wt% of C and the residue of Fe. Soft or hard glass sealing memeber 4, to which a lead 5 made of Fe-Ni alloy is inserted, is inserted to the through hole 3. When heat treated at a temperature not lower than 600 deg.C, the member 4 is bonded to the stem body 2 at approx. 500 deg.C and solidified. When the member is lowered to ambient temperature, the stem body is largely shrinked more than the sealing member, the compression stress is absobed by the elastic deformation, and both are effectively rigidly bonded.
申请公布号 JPS58164247(A) 申请公布日期 1983.09.29
申请号 JP19820047699 申请日期 1982.03.25
申请人 TOUSHIBA COMPONENTS KK 发明人 SASAKI SATOSHI;ISHIBASHI KOUTAROU
分类号 H01L23/12;H01L23/492 主分类号 H01L23/12
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