发明名称 THIN FILM FORMING DEVICE
摘要 PURPOSE:To perform sputtering stably for a long period of time by disposing targets and a substrate in a vacuum vessel, and providing a network member on the inside surface of the vessel to be stuck with films except the target parts and the substrates therein. CONSTITUTION:A thin film forming device is disposed with two targets spacially in parallel so as to face each other and forms films on a substrate 4 disposed on the side part between the targets by the plasma discharge between the targets 1 and 2. A network member, for example, a wire net 10 is mounted over the entire circumference on the inner side of the inside wall of a bell-jar 8 of said former. Therefore, the sputtering atoms 11 from the targets 1, 2 are hampered by the net 10, and the films stick among the meshes without sticking on the parts of the inside wall of the bell-jar 8 where the net 10 exists. The films sticking on the inside wall are thus broken to a length (l) and the internal stresses of the films are dispersed.
申请公布号 JPS58164782(A) 申请公布日期 1983.09.29
申请号 JP19820047126 申请日期 1982.03.26
申请人 HITACHI SEISAKUSHO KK 发明人 KAWANO KANJI;TANAKA KATSUYUKI
分类号 C23C14/34;C23C14/56;H01L21/285 主分类号 C23C14/34
代理机构 代理人
主权项
地址