| 摘要 |
PURPOSE:To enable to bond wirings by an automatic machine by bonding a film having a conductor layer of the prescribed pattern to the surface of a ceramic substrate between a semiconductor chip and the conductor layer connected to the external leads on the substrate to produce a wiring trunk point. CONSTITUTION:A frame-shaped polyimide film 13 is bonded to the periphery of a ceramic substrate 12, on which a semiconductor chip 11 is mounted, a Cu layer 14 of the prescribed pattern is formed on the film, the layer 14 is connected via wirings 15 to the bonding pad of the chip, and connected via wirings 18 to an Au-Ni plated W layer 17 connected to an external lead 16. According to this structure, since the Cu layer on the film is formed in the prescribed pattern even if displaced when the layer 17 is sintered to the substrate 12, an automatic bonding can be performed. The pattern of the layer 17 is disposed remotely as compared with the conventional chip, but the pitch of the layer 17 is reduced to increase the external lead 16, thereby improving the integration. |
