| 摘要 |
A process for extending and fixing conductors to circuit board base surfaces between pre-established spaced points in straight paths and pre-established spaced points in inflected paths, the steps comprising, fixing the end of the conductor to a pad at the first of a pair of pre-selected points and, while feeding the conductor with a guide, moving the board and the guide relative to each other along a straight path to a pad at the second of the pair of pre-established points or to a pad at an inflection point, if the conductor is to be inflected, and then to said second pad. Severing said conductor at said second pad and affixing the conductor end to said second pad. Repeating the foregoing steps until the conductor has been affixed to the pre-established pairs of pads and to the pads at the inflection points. After all of the pre-established spaced points have been interconnected with conductors either in straight or inflected paths, affixing the conductors to the board blank surface with a adhesive by applying pressure to the conductor pattern. |
