发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To prevent the coarsening of crystal grains in the root section of the ball of a wire, and to obtain a bonding loop of stable height by providing a cooling device which can cool the root section of the ball of the wire. CONSTITUTION:A ball 9 is formed at the tip of wire 8 penetrated into a bonding tool 7. A cooling element 10 is fitted to the lower section of the tool 7, and cools the lower section of the tool. Consequently, the root section of the ball 9 is cooled through the bonding tool 7 cooled by the cooling element 10 in the wire 8, and crystal grains 3A in a section B are made finer and stronger than those through conventional systems. Accordingly, the strength of the wire is improved, and the stable loop can be obtained.
申请公布号 JPS58161332(A) 申请公布日期 1983.09.24
申请号 JP19820042595 申请日期 1982.03.19
申请人 HITACHI SEISAKUSHO KK;HITACHI OUME DENSHI KK 发明人 FUJIOKA SHIYUNICHIROU
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
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