| 摘要 |
<p>PURPOSE:To increase a distance in space between a connecting member and a semiconductor base body, and to improve reliability by bending the connecting member so as to take a convex shape to the reverse side to the surface supporting the semiconductor base body from a straight line tieing connecting sections. CONSTITUTION:A semiconductor substrate 1 is placed onto a support board 2. Electrode terminal support members 3, 4 are placed onto the board 2 while being separated from the substrate 1 through metallized layers 31, 32, 41, 42. The surfaces on the reverse side to the board 2 sides of the member 3, 4 are formed so as to be made higher than the surface on the reverse side to the board 2 side of the substrate 1. The connecting members 5, 6 are bonded with metallic foil 51, 61, and constituted by insulating films 52a, 52b, 52c, 62a, 62b divided into the plural among nodes. The members 5, 6 are bent at the dividing points of the insulating films so as to take the convex shape to the reverse side to the board 2 side from the straight lines 7 tieing bonded points.</p> |
