| 摘要 |
<p>PURPOSE:To inhibit the electrolytic etching of aluminum, and to reduce the corrosion of the aluminum pad of a plastic molded IC by implanting ions to the aluminum surface of the bonding pad. CONSTITUTION:The corrosion of a bonding pad results from hydrogen ions. Consequently, the electrolytic etching of aluminum can be inhibited by implanting ions to the aluminum surface and bringing an aluminum surface region to an amorphous state. When ions are implanted before forming a passivation film, however, the inhibiting effect of aluminum corrosion is lost because aluminum brought to the amorphous state returns to a state before implanting ions through high-temperature treatment in case of the formation of the passivation film. Accordingly, it is necessary to form the passivation film 1, etch the surface and implant ions in a bonding pad section 5.</p> |
