| 摘要 |
PURPOSE:To obtain the holder for the semiconductor wafer, in a peripheral section thereof stains are not generated after grinding processing and which is freely detachable, by notching a fitting groove to the outer circumferential section of a porous metallic plate for adsorbing the wafer under vauum and sealing the groove with a filmy sealing material consisting of an elastic body. CONSTITUTION:When the fitting groove 16 is supplied with air through a ventilating groove 21 and a ventilating hole 20, the sealing material 18 is expanded to the outside. The wafer is placed onto the sealing material 18, sucked by a vacuum pump through a suction groove 23 and a suction hole 12, and adsorbed onto a sheet 28 under vacuum. After grinding is completed, air expanding the sealing material 18 is discharged while air is supplied in the direction reverse to the arrow 30, thus easily exfoliating the wafer from the sealing material 18. Even when a grinding material injected during grinding intrudes into the sealing material from the position of an external fixing plate 19, the grinding material does not reach the position of an internal fixing plate 19 because the grinding material is detained in the fitting groove 16, and stains are not generated around the wafer. |
