发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To reduce the defects of Ga, and to improve crystallinity at an AB1-XCX intermetallic compound semiconductor crystal having Ga as the A element by a method wherein the C element is introduced or the B element is introduced according to the value X of the composition ratio, and the defects of Ga in the crystal are replaced with the elements thereof. CONSTITUTION:At the AB1-XCX intermetallic compound semiconductor crystal having Ga as the A element, the C element is introduced when the composition ratio X is 0<= X<=0.45, the B element is introduced when 0.45<=X<=1, and the defects of Ga in the crystal are replaced with the C element or the B element. The crystal is GaAs when composition ratio is X=0, and the crystal is GaP when X=1, and although GaAs is the direct transition type and GaP is the indirect transition type, GaAs1-XPX is the direct transition type in the range of 0<=X<=0.45 at the room temperature. After an epitaxial layer is formed on a GaAs wafer 1, and phosphorus ions are implanted in the whole surface of a P type layer 4 by the implanting quantity of 10<15>cm<3> for improvement of crystallinity, a heat treatment is performed. Ni-Zn-Au are evaporated on the surface of the P type layer for formation of electrodes. Au-Ge are evaporated on the surface of an N type layer, and the chip thereof is incorporated in an enclosing vessel to manufacture the diode.
申请公布号 JPS58159386(A) 申请公布日期 1983.09.21
申请号 JP19820042192 申请日期 1982.03.17
申请人 NIPPON DENKI KK 发明人 NEMOTO KUNIHARU
分类号 H01L33/30;H01L33/40 主分类号 H01L33/30
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