| 摘要 |
PURPOSE:To obtain a hybrid integrated circuit having high reliability by forming a thin metal film pattern on an insulating substrate, placing a metal lead on the pattern, covering and sintering a thick film conductor passage on the connecting part, thereby increasing the bonding strength. CONSTITUTION:When a Pt temperature sensor is formed by utilizing variation in the resistance upon varying of the temperature of the Pt, the steps are performed as follows: A thin Pt film 2 is covered by sputtering on an insulating substrate 1 made of ceramics or the like, photoetched to form the prescribed pattern. Subsequently, in order to adjust the resistance temperature coefficient, a heat treatment of 800-1,400 deg.C is performed, and metal leads 4 made of Pt or the like is carried on the external lead connecting electrode 3 of the film 2. Then, a thick film conductor paste 5 made of silver-palladium paste is adhered to the leads, and sintered at 400-1,000 deg.C. In this manner, the bonding strength between the lead 4 and the electrode 3 becomes sufficient, and the bonding strength between the paste 5 and the substrate 1 can be increased. |
