| 摘要 |
PURPOSE:To maintain the simplicity of assembling and secure flexibility in usage of the lead frame type semiconductor device by a method wherein, after leadless type external connecting terminals have been formed in various standardized sizes and they have been assembled, an external lead is attached and used as the semiconductor device. CONSTITUTION:A synthetic resin laminated plate such as glass triazine and the like is used for an insulating substrate 1, a Cu foil is adhered on the front and back sides of the substrate, necessary processings such as a working on aperture and a Cu plating process for its activation have been performed successively, and after a through-hole plating has been performed if necessary, the unnecessary Cu foil is removed. A conductive pattern 2 is formed through the above-mentioned procedures. Then, a semiconductor element 3 is mounted on the layer 4 whereon thermosetting conductive paste was coated. Subsequently, the paste is hardened by heating the substrate, and a semiconductor element is adhered. Then, the semiconductor element 3 and the conductor pattern 2 located on the insulated substrate are electrically connected. A resin frame 5 is then adhered, and thermosetting resin 6 is filled in the cavity part located inside the resin frame 5. The above-mentioned processes can be performed in a series, thereby enabling to substantially reduce the assembling manhours, which is suited for the mass production of the titled device. |
