发明名称 |
ELECTROCHEMICAL TREATMENT OF METAL OR METALLIC FOIL FOR IMPROVING ITS BOND STRENGTH |
摘要 |
A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil. |
申请公布号 |
GB2116213(A) |
申请公布日期 |
1983.09.21 |
申请号 |
GB19830005975 |
申请日期 |
1983.03.04 |
申请人 |
* OLIN CORPORATION |
发明人 |
NED WILLIAM * POLAN;* CHUNG-YAO CHAO |
分类号 |
C25D5/16;C25D5/18;H05K3/38;(IPC1-7):25D5/18;25D7/06 |
主分类号 |
C25D5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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