| 摘要 |
PURPOSE:To prevent the pollution of the surface of the wafer even when dust and fouling adhere while increasing mechanical strength by forming a film made of plastics dissolved into an organic solvent onto the wafer, the surface thereof is kept clean. CONSTITUTION:An applying liquid B is applied onto the semiconductor wafer A with the clean surface. The liquid is applied C arbitrarily. The liquid may be dropped onto the wafer A by using a filler. The liquid may be sprayed by an atomizer, etc. The wafer A is dried D. The wafer is dried naturally at the normal temperature and may be done so for approximately twelve hr. Plastics is solidified and changed into a film after drying, and the semiconductor wafer E with the surface protective film can be manufactured. With regard to the (plastics/solvent) applying liquid B, plastics may be acetylcellulose group resin and the organic solvent may be methyl acetate. |
