| 摘要 |
PURPOSE:To effectively enable to assemble a semiconductor device by bending the lead of an upside semiconductor device from the intermediate course inwardly and pressing it laterally from the lower side lead. CONSTITUTION:The ends of leads of upper package 2 is converged at the part of the leads of the lower and upper packages 1 and 2 to be superposed, and the lower lead is retained by the upper lead when superposed. A guide 3 having a tapered part 3a is placed on the lower package 1, thereby pressing the upper package 2 and superposing them. The superposed parts are soldered. Accordingly this configuration, a plurality of semiconductor devices can be readily and effectively superposed, and the superposing and soldering works can be further automated. |
