| 摘要 |
A hermetically sealed flat-type piezo-electric oscillator assembly comprising a flat-type package and a piezo-electric oscillator encased in the package. The flat-type package comprises metal frame, an insulating material portion united to the frame to form the package, and a plurality of lead wires passing through the insulating material portion to provide terminals inside of the package, and having opening for insertion of the piezo-electric oscillator element therein such that the piezo-electric oscillator element is mounted on the terminals of the lead wires. A lid is placed over the opening of the package so as to hermetically seal the package with the oscillator element encased therein. At least two side faces of the insulating material portion are, at least in part, positioned within the space defined by the metal frame to engage with an inwardly facing surface of the metal frame.
|
