发明名称 Electrodeposition of coatings on metals to enhance adhesive bonding
摘要 The invention is directed to the electrodeposition of a coating of a phosphorylated amide on a metal such as aluminum, and the formation of a chemical bond between the metal and the coating, such amide being in the form of (a) an organic polymer consisting of a poly (phosphinohydrazide), a poly (phosphinoguanide) or a poly (phosphinoureide), including homopolymers and copolymers thereof, and their thio analogs or (b) a 2:1 molar adduct of a nitrogen-containing compound such as hydrazine, guanidine or urea or its thio analog, and an organic phosphite or phosphonate. In the method of electrolytically depositing such coating on the metal substrate, e.g., aluminum, the substrate is employed as the anode in a non-aqueous or aqueous electrolyte containing a phosphorylated amide of the type noted above, e.g., poly (phosphinohydrazide), and electro-depositing a coating on the metal substrate, the organic coating formed being chemically bonded to the substrate, thereby enhancing adhesive bonding to the metal substrate, such coating being strongly bonded to the substrate and being corrosion resistant.
申请公布号 US4405427(A) 申请公布日期 1983.09.20
申请号 US19810317162 申请日期 1981.11.02
申请人 MCDONNELL DOUGLAS CORPORATION 发明人 BYRD, NORMAN R.
分类号 C09D5/44;(IPC1-7):C25D13/06;C25D13/08 主分类号 C09D5/44
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