| 摘要 |
PURPOSE:To make thin a printed circuit board by a method wherein unlinked parallel electric circuits and the similar circuits prepared with a conductive material are respectively formed on one metal lined layer surface of a plastic magnetic laminar board containing magnetic electrically insulating metal oxide and the other surface thereof and the ends of the circuits on the top and back surfaces to form a coil wound circuit. CONSTITUTION:Unlinked electric circuits 2 are formed on the metal lined layer of a magnetic laminar board 1 with one side lined with copper and unlinked parallel electric circuits 2' are formed with conductive silver paste on the other. Each end 4, 4' of the electric circuits on top and back surfaces are linked by means of a through hole 3 to prepare a coil wound circuit 5, or a print inductance. |
