发明名称 CONTACT FOR SUPERCONDUCTIVE CIRCUIT
摘要 PURPOSE:To obtain a contact for a superconductive circuit whereby a superconductive current of stability and high density can be obtained by a method wherein, in a Josephson logic integrated circuit, etc., it is formed into a double layer structure wherein an Au metallic thin film is evaporated on an Nb metallic thin film when a multi layer wiring is performed. CONSTITUTION:Using the contact constituted of an Nb metallic thin film 1 and an Au metallic thin film 2, superconductive Pb alloy wirings 5 and 6 manufactured by diffferent processes are connected via the contact surfaces 3 and 4 with the superconductive wirings. A Pb alloy which is joined, to the surface of the Nb metal which has strong mechanic strength and shows good superconductivity but is week to oxidation, by a method wherein the Au metal showing resistance to oxidation is formed as a protection film, and the Au metal is formed extremely thin obtains a good superconductive contact by absorbing the Au metal by diffusion. Thereat, the Pb alloy does not loss its superconductivity even by absorbing the Au metal. Thereby, the Pb alloy superconductive lines 5 and 6 are practically connected to the Nb metallic thin film, and this connection also becomes a good superconductive contact.
申请公布号 JPS58157181(A) 申请公布日期 1983.09.19
申请号 JP19820039243 申请日期 1982.03.12
申请人 KOGYO GIJUTSUIN (JAPAN) 发明人 NAKAGAWA HIROSHI;SOKAWA HIDEKAZU
分类号 H01L39/22;H01L39/02 主分类号 H01L39/22
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