| 摘要 |
<p>A compsn. comprises (1) a copolymer contg. at least 25 wt.% ethylene and at least a vinyl ester and (2) 0.5-20, pref. 2-10 wt.% of a copolyetheresteramode (I). The compsn. is claimed for use as (hot melt) adhesive. Inclusion of (I) improves the comport of the adhesive with increasing temp. (e.g. improved peel strength, shear strength and creep resistance) without adversely affecting the melt viscosity and the softening pt. of the compsn. The compsn. is used for packaging, binding and in the wood industry.</p> |
