| 摘要 |
<p>An integrated circuit lead frame (10) for use in the plastic encapsulation of integrated circuit impedes the progress of contaminants to the bonding pads of an integrated circuit die by forming grooves (26) in the leads (18) interior the plastic package, providing an enlarged perforation (22) in the leads (18), and either extending the bonding area (24a, 24b) of the leads away from the perforation (22) of providing the bonding area directly behind the perforation (22).</p> |
