| 摘要 |
PURPOSE:To contrive not to damage wire-bonding parts without contaminating a recessed part for mounting a semiconductor chip due to plating by a method wherein an internal layer material having the recessed part is formed, and an insulating substarte for an external layer, a part of whose back surface corresponding to the recessed part for mounting is cut to form a thin layer, is laminated on the surface of the internal layer material to form a multilayer. CONSTITUTION:Insulating substrates 1 for an internal layer with an internal layer circuit formed thereon are laminated and an internal layer material 4 having a recessed part 3 for mounting a semiconductor chip 2 on the surface side is formed. Then, a part of the back surface of an insulating substrate 5 for an external layer to become an outermost layer, which corresponds to the recessed part 3 of the internal layer material 4, is cut to form a thin layer 6, and the insulating substrate 5 for an external layer is laminated on the surface of the internal layer material 4 to form a multilayer. After this, processings for opening holes 13, through hole plating and the formation of an external layer are performed in order to form a multilayer printed interconnection board. Then, the thin layer 6 is cut and removed from the surface side of the outermost layer and the semiconductor chip 2 is mounted on the exposed recessed part 3 for mounting. |
