发明名称 FINE WIRE OF GOLD ALLOY FOR BONDING SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To obtain a high tensile strength under a normal and high temperature ambient and prevent generation of deformed loop by providing a fine wire of alloy with cerium group rare earth element, Ge, Be, Ca, Au and essential impurity mixed in the specified rate. CONSTITUTION:A cerium group rare earth element is effective for improving tensile strength under a high temperature but if amount of content is under 3/ 10,000%, such tensile strength cannot be acquired and if it exceeds 1/100%, such element shows in turn brittleness. Ge, Be, Ca raise a softening temperature of a fine wire in coexistence with a cerium group rare earth element, suppressing generation of brittleness and deformed loop and also raising a tensile strength under a normal and high temperature. If content is under 1/10,000%, such effect cannot be obtained but it exceeds 6/1,000%, the element shows some brittleness. Therefore, the fine wire of gold alloy is formed with 0.0003-0.01wt% cerium group rare earth element, 0.0001-0.006wt% Be, Ge, Ca and Au and essential impurity as the remainders.
申请公布号 JPS58154242(A) 申请公布日期 1983.09.13
申请号 JP19820037580 申请日期 1982.03.10
申请人 MITSUBISHI KINZOKU KK 发明人 HOSODA NAOYUKI;TANAKA MASAYUKI;MORI TAMOTSU
分类号 C22C5/02;H01L21/60 主分类号 C22C5/02
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