发明名称 HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To enable to realize dry sealing easily by a method wherein flange parts and clicks protruding inside from the flange parts are provided to a metal vessel, and a cover body and a substrate are calked by the clicks thereof. CONSTITUTION:A hybrid integrated circuit is constituted of a hybrid integrated circuit substrate 11 assembled with a desired circuit element, a frame type packing material 12, a cover body 13 and a metal vessel 14. The vessel 14 is formed in the shape to enclose the cover body 13 and the substrate 11, and the flange parts 15 are provided at both the edges. Clicks 17 of a plural number protruding inside are provided to the flange parts 15. The cover body 13 and the substrate 11 are adhered by pressure in the vessel 14 by calking with the clicks 17 thereof, and are sealed hermetically according to the packing material 12. Hermetically sealing structure according to dry sealing can be attained easily by the packing material 12 and the vessel 14, and automation of the sealing process can be attained easily.
申请公布号 JPS58153354(A) 申请公布日期 1983.09.12
申请号 JP19820037107 申请日期 1982.03.08
申请人 SANYO DENKI KK;TOKYO SANYO DENKI KK 发明人 MIURA YOSHIO
分类号 H05K5/06;H01L21/50;H01L23/02 主分类号 H05K5/06
代理机构 代理人
主权项
地址