| 摘要 |
PURPOSE:To eliminate the individual bonding of an integrated circuit chip and each lead of recording elements and to make it possible to perform connection of a photolithography process, by forming the thin film transistor circuit on the same substrate for the recording elements (heating resistor bodies) instead of an integrated circuit chip. CONSTITUTION:In the recording head wherein a plurality of recording elements (e.g. heating bodies) 1a1-1a9 are arranged, driving amplifiers 471-499, which drive the driving elements 1a, and recording control circuits 451-459, 44, and 43, which control the amplifiers in response to a picture signal, are constituted by the thin film transistors 51-56. The recording elements 1a and the thin film transistors 51-56 are arranged on the same substrate 57. For example, the thin film transistor, which comprises a semiconductor thin film 51, source and drain electrodes 52, an insulating film 53, a gate electrode 54, and the like, is provided on the substrate 57. The thin film material of the semiconductor thin film 51 and the source or drain electrode 52 are elongated and the thin film resistor 58 is constituted. Thus the thin film transistor circuit and the heating resistor body are simultaneously formed. |
