| 摘要 |
<p>PURPOSE:To obtain the titled composition which has excellent heat resistance, moisture resistance, electrical insulating properties, and adhesion properties and is radiation-curable, by mixing an epoxy poly(meth)acrylate, a specified unsaturated compound, and another unsaturated compound. CONSTITUTION:A resin composition which contains an epoxy poly(meth)acrylate (A) having 2 or more (meth)acryloyl groups in a molecule obtained by reacting an epoxy resin with (meth)acrylic acid; a compound (B) of the formula (wherein R1 is H or CH3); another unsaturated compound (C); and optionally a photopolymerization initiator (D). A preferable amount of each component based on 100pts.wt. in total of components A-D is as follows: 10-50pts.wt. component A; 5-60pts.wt. component B; 1-60pts.wt. component C; 0-15pts.wt. component D.</p> |
