| 摘要 |
<p>PURPOSE:To discriminate marks for ZIPs easily from the upper section of a substrate even when the ZIPs are mounted onto the substrate with high density by forming the marks for the ZIPs on the side surface of a main body and a surface except the side surface. CONSTITUTION:Marks 3 are shaped to mark sections 3a in the side surfaces of a main body, and marks 4 are formed to mark sections 4a in surfaces except the side surfaces. Marks having recessed surfaces or projecting surfaces are shaped on the molding of a package by forming the type name or the like of an IC by the projected surfaces or the recessed surfaces in a molding die for an IC package in the marks 4. Accordingly, the marks are shaped not only on the side surfaces of a package body but also on the surfaces except the side surfaces, thus easily discriminating the marks for ZIPs from the upper section of a substrate even when the ZIPs are mounted onto the substrate with high density.</p> |
