| 摘要 |
<p>PURPOSE:To contrive not to damage wire-bonding parts without contaminating a recessed part for mounting a semiconductor chip due to plating by a method wherein an internal layer material having the recessed part for mounting is formed, the wire-bonding parts in this recessed part for mounting are coated with a soft material, then an insulating substrate for an external layer is laminated on the surface of the internal layer material and a multilayer is formed. CONSTITUTION:Plural sheets of insulating substrates 1 for an internal layer with an internal layer circuit formed thereon are laminated, an internal layer material 4 having a recessed part 3 for mounting a semiconductor chip 2 is formed on the surface side of the laminated material and wire-bonding parts 9 in this recessed part 3 for mounting are coated with a soft material 6 like an adhesive tape. Then, an insulating substrate 5 for an external layer, which is used as an outermost layer, is laminated on the surface of the internal layer material 4 and a multilayer is formed. After this, processings for opening holes 13, through hole plating and the formation of the external layer are performed in order to form a multilayer printed interconnection board 7. Then, a part 5a, which corresponds to the recessed part 3 for mounting of the internal layer material 4, of the insulating substrate 5 for an external layer is cut from the outermost layer to expose the recessed part 3 for mounting, the adhesive tape 6 is removed by peeling and after this, the semiconductor chip 2 is mounted on the recessed part 3 for mounting.</p> |
