| 摘要 |
PURPOSE:To obtain a soldering device which provides excellent soldering free of unevenness of solder sticking by providing solder spraying device in front of a molten solder vessel and providing a noncontacting type infrared-ray heating means, etc., in front of it. CONSTITUTION:Said heating device 3 heats a soldered part 4 of a printed board carried by a conveying mechanism as shown by an arrow up to the melting temperature of solder. Simultaneously, the solder spraying device 2 actuated through a limit switch 5 sprays the heated part with solder. Thus, the sprayed solder is entered between parts, and fine parts between the parts and printed board. Flux applied by a fluxer 7 and a preheater 6 remains at the soldered part and the successively carried printed board is conveyed as it is to the process of the molten solder vessel 1. Then, the part soldered by the device 2 is finished and an excessive or a deficient part are corrected to complete the soldering. |
