| 摘要 |
A thin-film IC chip (5), a resistor (7) and the like are mounted on a substrate (15) consisting of ceramic material having a low dielectric constant, such as aluminium oxide and the like, which also has a high mechanical strength but a low chemical reactivity. The substrate (15) has electrodes (2, 12) on its circumference. Arranged above the substrate (15) is a capacitor part (1) which has only one connecting electrode (11) and consists of a ceramic material with a high dielectric constant. The capacitor part (1) forms the top layer, the substrate (15) forms a central layer, and a printed-circuit board (9) for wiring and for connection of the above parts to other electronic components is used as the bottom layer. In this way, parasitic capacitances which result from the connection to the printed-circuit board of electrodes which are not connected to the inner electrode of the capacitor part, are to a large extent reduced. <IMAGE>
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