摘要 |
PURPOSE:To suppress warpage and distortion of package at the time of resin sealing by providing a slit to a frame in both sides of longitudinal direction of a lead frame. CONSTITUTION:Distortion generated in the longitudinal direction can be absorbed by forming a slit 6 in both sides 5 of the longitudinal direction of lead frame. Thereby, warpage in the longitudinal direction of frame as a whole due to contraction of resin can be prevented and reliability and working efficiency of device can be as much improved. |