发明名称 LEAD FRAME
摘要 PURPOSE:To suppress warpage and distortion of package at the time of resin sealing by providing a slit to a frame in both sides of longitudinal direction of a lead frame. CONSTITUTION:Distortion generated in the longitudinal direction can be absorbed by forming a slit 6 in both sides 5 of the longitudinal direction of lead frame. Thereby, warpage in the longitudinal direction of frame as a whole due to contraction of resin can be prevented and reliability and working efficiency of device can be as much improved.
申请公布号 JPS58151050(A) 申请公布日期 1983.09.08
申请号 JP19830016068 申请日期 1983.02.04
申请人 HITACHI SEISAKUSHO KK 发明人 INAYOSHI HIDEO;WAKASHIMA YOSHIAKI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
代理机构 代理人
主权项
地址