| 摘要 |
PURPOSE:To realize curtailment of time and improvement in manufacturing accuracy by detecting a fuse blowing area of chip and beam irradiating location in the SEM mode with a low current and small diameter and by cutting chips in a large current and large diameter mode using a charged beam. CONSTITUTION:A board 4 is moved so that the origin mark 42 and the Flade cup 15 can be aligned to the center of optical system. Then, the conditions of SEM mode and cutting mode are stored in the memory of computer. A wafer 3 is placed on the board 4, a wafer mark 43 is detected in the SEM mode, a number of times n=1 is set by repetition, and a mark 44 of the n-th chip 46 is detected with reference to the mark 43. A pad 45 is obtained with reference to the mark 44, a defective area is searched by sending a signal from a computer using a probe placed in contact, and thereby the phase position to be cut is determined. Operation mode is changed to the cutting mode, position is compensated by the mark 44, a chip is cut by irradiating the beam to the fixed position for (t) seconds and then the board 4 is moved to the next chip position. Cutting is completed when n>=m, for the number of chips. According to this structure, damaged regions other than the cutting region are eliminated and manufacturing accuracy can also be improved through quick cutting. |
