Transducer isolation in surface acoustic wave processor

摘要

The invention is an improved manufacturing technique for producing a certain class of Surface Acoustic Wave (SAW) devices, namely those having input and output transducers in close proximity. A much higher manufacturing yield results from eliminating the cutting of a slot in the substrate between input and output transducers as formerly done. This frequently destructive step is replaced by ion-milling of a deep groove between the ports and backfilling with a metal of proper configuration to provide electromagnetic shielding. The technique produces a new device that is at least equal to the prior art in rejection of unwanted couplings between input and output.