| 摘要 |
The present invention extends the service life of a semi-conductor laser element by bonding a light transmitting member for transmitting the output light from said laser element to a support member for said transmitting member with soft metal solder to improve hermetic sealing therebetween. The beam diameter of the output light generated by said semi-conductor laser element is not substantially changed when passing through the transmitting member since said bonding is conducted at a temperature not causing deformation by softening of said light transmitting member that could cause formation of a distortion therein. The surfacial precision of said light transmitting member also is improved by selecting the thermal expansion coefficient of the material constituting said light transmitting member to be approximately equal to that of said support member. Therefore, the invention provides a semi-conductor laser apparatus applicable in equipment requiring a high resolution.
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