发明名称 Method of forming a circuit board
摘要 A circuit board is fabricated by injection molding a support of an insulating material. The support is provided with channels in the pattern of conductive paths. The channels are filled by injection with electrically conductive plastic, and electrically conductive metal is precipitated galvanoplastically on the plastic.
申请公布号 US4402135(A) 申请公布日期 1983.09.06
申请号 US19810250830 申请日期 1981.04.03
申请人 BRAUN AKTIENGESELLSCHAFT 发明人 SCHWEINGRUBER, OTTO;HAEFNER, WERNER
分类号 H05K3/18;H05K1/09;H05K3/10;H05K3/24;H05K3/32;(IPC1-7):H05K3/30 主分类号 H05K3/18
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