发明名称 |
Socket for integrated circuit package with extended leads |
摘要 |
A socket for connecting an integrated circuit package to a printed circuit board or the like wherein the connection between the circuit board and the semiconductor chip is as short as possible. This is accomplished by providing a straight line conductor between the integrated circuit package and the printed circuit board. In accordance with one embodiment, a contact in the form of a movable double ended sharp needle is employed to connect the lead from the package to the lead on a substrate. In order to provide the force mating the leads and the intermediate needle, external force is provided by a spring structure comprising a multi-fingered element with the tips of the fingers encapsulated in plastic or other compliant membrane separating the spring member and the leads of the package.
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申请公布号 |
US4402561(A) |
申请公布日期 |
1983.09.06 |
申请号 |
US19810248606 |
申请日期 |
1981.03.27 |
申请人 |
AMP INCORPORATED |
发明人 |
GRABBE, DIMITRY G.;KORSUNSKY, IOSIF |
分类号 |
H05K7/10;(IPC1-7):H05K1/04 |
主分类号 |
H05K7/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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