发明名称 AXIAL LEAD HEAT SINK
摘要 <p>AXIAL LEAD HEAT SINK A heat sink adaptable for insertion into the plated through holes of a printed circuit (pc) assembly and for receiving and cooling axial lead circuit components contained within the pc mounting collar of the heat sink. The heat sinks being contained by compressive stress during initial assembly; and the heat sinks and axial leads of the components later being wave soldered to the pc assembly.</p>
申请公布号 CA1153476(A) 申请公布日期 1983.09.06
申请号 CA19810379762 申请日期 1981.06.15
申请人 SPERRY CORPORATION 发明人 FEELEY, LEGRAND D.;RASSY, EDDY I.
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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