| 摘要 |
PURPOSE:To improve the adhesive strength of a resist film to its substrate, by adding epoxy resin to a positive type photoresist composition contg. a quinonediazido compound as a photosensitive agent. CONSTITUTION:Epoxy resin having 200-20,000mol.wt. is added to a positive type photoresist composition consisting of a photosensitive component contg. a quinonediazido group, an alkali-soluble resin component and a solvent. Thus, a pattern with high resolution is obtd. Without deteriorating the developability of the original positive type photoresist, and the resist pattern has remarkably improved adhesive strength to its substrate. |
