| 摘要 |
PURPOSE:To facilitate extremely sealing work necessitating no vaccum device by a method wherein the chip carrier and a lid are adhered according to thermosetting resin discharging nitrogen gas in the open condition. CONSTITUTION:A chip carrier package 1, a heater 8, etc., are in the open condition, and structures thereof exist in air. A nitrogen gas dischargingly supply tube 10 to discharge notrogen gas is provided in the neighborhood of the chip carrier package 1. The lid 9 is pressed to the upper edge face of the chip carrier package 1 being held in the condition discharging nitrogen gas between the chip carrier package 1 and the lid 9 as it is. Air is driven out, and nitrogen gas is filled in inside space of the chip carrier package 1. Because heating is applied according to the heater 8, the adhesive of thermosetting epoxy resin is hardened, and nitrogen gas is enclosed in inside space of the lid 9 of the chip carrier package 1. |
