| 摘要 |
<p>PURPOSE:To increase the IC mount density as a multi-structure by a method wherein some of the leads of a slave hybrid IC are fixed on the substrate of a master hybrid IC, after lead through-holes are opened on the master hybrid IC and the leads of the slave hybrid IC are inserted into these through-holes. CONSTITUTION:A conductor pattern, a resistance pattern, a glass pattern, etc. are repeatedly printed in thick film on a ceramic thick film substrate into a master hybrid IC element 1. For a slave hybrid IC element 2, a conductor, a resistor, a glass pattern, etc. are repeatedly printed in thick film on a ceramic thick film printed substrate, and it is placed on the element 1. Thereat, a plurality of leads 3 and 4 which project downward at equal intervals are planted on the both sides right and left of the elements 1 and 2, and the through-holes 7 to insert the leads 4 of the element 2 are provided on the element 1. Thus, the leads 4 which are required are pushed into the holes 7 and fixed by solder 9, and accordingly the projected leads 4 are connected to the leads 3.</p> |
