发明名称 |
Method for manufacturing a fine-patterned thick film conductor structure |
摘要 |
A method for manufacturing a fine-patterned thick film conductor structure free from ununiformity in film thickness comprises steps of forming resist on a thin metal plate at areas other than land areas, electroplating the thin metal plate using the thin metal plate as a cathode electrode to form conductors having a circuit density of no less than three lines/mm and a thickness of 15-200 mu m, bonding the electroplated thin metal plate to an insulative substrate with the thin metal plate side facing up and etching the thin metal plate. The fine-patterned conductors are suited for use in small-sized coils, high density connectors and high density wirings. Further disclosed is a method for manufacturing a fine-patterned thick film printed circuit board free from side protrusion comprising steps of forming resist on a thin metal plate at areas other than land areas, electroplating the thin metal plate to a thickness of 0.3-10 mu m at a current density of 0.05-2 A/dm2, electroplating the thin metal plate to a desired final thickness at a current density of 3-20 A/dm2, and removing all or the areas other than the land areas of the thin metal plate.
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申请公布号 |
US4401521(A) |
申请公布日期 |
1983.08.30 |
申请号 |
US19810323337 |
申请日期 |
1981.11.20 |
申请人 |
ASAHI KASEI KOGYO KABUSHIKI KAISHA |
发明人 |
OHMURA, KAORU;KOYAMA, RYOHEI;KIMURA, TAKEO |
分类号 |
H05K3/20;H05K3/38;(IPC1-7):C25D1/00;C25D1/20 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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