发明名称 ELECTROLESS COPPER PLATING LIQUID
摘要 PURPOSE:To provide an electroless copper plating liquid capable of obtaining plated copper having high tensile strength and flexural fatique strength, by adding a silver ion supply source and aminoalcohol to an electroless copper plating liquid comprising a usual composition. CONSTITUTION:To an electroless copper plating liquid containing a copper salt, a complexing agent, a reducing agent and a pH controller, a silver ion supply source and aminoalcohol are added and said silver ion supply source is added so as to adjut the silver ion concn. in the plating liquid such that the enhancement in the tensile strength and the flexural fatique strength of obtaied plated copper is recognized and the plating liquid is not decomposed while aminoalcohol is added in an amount of 0.001g/l or more. As the silver ion supply source, metal silver or silver iodide is especially suitable and the addition amount thereof is about 1mg/l. The addition amount of aminoalcohol is pref. about 0.01-10g/l and, more pref., about 0.5-5g/l.
申请公布号 JPS58144465(A) 申请公布日期 1983.08.27
申请号 JP19820027584 申请日期 1982.02.22
申请人 HITACHI KASEI KOGYO KK 发明人 YAMANOI KIYOSHI;NAKASO AKISHI;OKAMURA TOSHIROU
分类号 C23C18/40 主分类号 C23C18/40
代理机构 代理人
主权项
地址