| 摘要 |
A process for dielectrically embossing flexible foam, e.g. polyurethane foam assemblies, in which the foam is thermally reticulated prior to being dielectrically embossed. Inconsistencies in the dielectric embossing process are essentially eliminated by the thermal reticulation pretreatment of the foam. There is also disclosed a dielectrically embossed laminate including a thermally reticulated dielectrically active flexible foam. |
