| 摘要 |
PURPOSE:To reduce steep stepwise differences the lower layer wiring pattern forms and thus prevent the short-circuit between the uppermost wirings by a method wherein a photo resist film is left on the region except for the part of the uppermost layer wiring, and thereafter a base metallic film and an Au plated wiring are superposed. CONSTITUTION:A through hole 8 for connection is provided on a layer insulation film 2, and the resist 9 is spin-coated on the part except for the Au plated wiring of the uppermost layer. Next, the double base film 3 of Ti-Pt is adhered, then a photo resist pattern 4 equal to the resist 9 is superposed again, and the exposed base film 3 is Au plated 5 resulting in the formation of a wiring pattern. Then, the mask 4 is removed, and, with the Au plated film 5 as a mask, the unnecessary base metallic film 3 is removed by vertically irradiating Ar ions. Thereat, since the steep stepwise difference of the lower layer wiring 1 is reduced by the resist 9, the base metallic film 3 can be perfectly removed in the same manner as the flat part. Finally the resist 9 is removed into the completion. |
